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Abstract Micro light emitting diodes (MicroLEDs) provide unrivaled luminance and operating lifetime, which has led to significant activity using devices for display and non‐display applications. The small size and high power density of microLEDs, however, causes increased adverse heating effects that can limit performance. A new generation of electrically insulating high thermal conductivity materials, such as alumina, is proposed to mitigate these thermal effects when used as a substrate as an alternative to glass. This strategy can then be used as a method of passive heat sinking to improve the overall performance of the microLED. In this work, a newly available material, an 80 micron thick alumina ceramic substrate, is shown to yield a 30 % improvement on average in the maximum current drive over a glass substrate. 

Abstract Hybrid organic–inorganic perovskites enable the production of semiconductor devices at low cost from solution processing. Their remarkable structural versatility offers unique and diverse physical properties, leading to their incorporation in a wide variety of applications. One major limitation is the significant negative environmental impact associated with developing perovskite devices; common solvents used in perovskite film deposition are highly toxic, which represents a barrier to the transfer to an industrial setting of the perovskite technology. Here we report on the fabrication and characterisation of the first laser printed organic–inorganic perovskite films. The method is solvent-free, scalable and low-cost, allowing fast deposition over large areas and with minimal material waste. We show that the laser printed perovskite films are crystalline and exhibit electrical properties on par with single crystals, despite the fact that the microstructure consists of randomly oriented crystallites. The toner used during printing is designed for optimal film transfer and the vertical separation of its components results in a segregation of the perovskite film in the middle of the stack, therefore also encapsulating the perovskite layer, a process that yields a remarkable resilience to defect formation upon environmental exposure.